Post by dkennedy on Jul 17, 2008 6:47:23 GMT -5
Samsung commences design and manufacturing of embedded 3-D HDTV chip
July 16, 2008
Trading Markets Press Release
DDD Group, a 3D software and content company, has announced that following the successful conclusion of the market research phase, Samsung Electronics Company has confirmed that it is proceeding with the development and manufacture of a low cost 3-D chip based on DDD's TriDef 3-D functions for Samsung's next generation 3-D HDTVs.
The license agreement was announced in February 2008 and allows Samsung to design and mass manufacture the low cost chip based upon DDD's TriDef real-time 2-D to 3-D conversion and 3-D image processing architecture.
The chip can be used in a variety of 3-D HDTVs including plasma, LCD and DLP televisions. An advance royalty of approximately GBP165, 000 is now due under the terms of the license agreement.
During the next few months, DDD expects Samsung to provide guidance on the number of next generation 2009 3-D HDTV models that will include the chip once Samsung has concluded the product planning for their 2009 model range.
July 16, 2008
Trading Markets Press Release
DDD Group, a 3D software and content company, has announced that following the successful conclusion of the market research phase, Samsung Electronics Company has confirmed that it is proceeding with the development and manufacture of a low cost 3-D chip based on DDD's TriDef 3-D functions for Samsung's next generation 3-D HDTVs.
The license agreement was announced in February 2008 and allows Samsung to design and mass manufacture the low cost chip based upon DDD's TriDef real-time 2-D to 3-D conversion and 3-D image processing architecture.
The chip can be used in a variety of 3-D HDTVs including plasma, LCD and DLP televisions. An advance royalty of approximately GBP165, 000 is now due under the terms of the license agreement.
During the next few months, DDD expects Samsung to provide guidance on the number of next generation 2009 3-D HDTV models that will include the chip once Samsung has concluded the product planning for their 2009 model range.